25K/Bottle BGA Solder Ball 0.25 0.3 0.35 0.4 0.45 0.5 0.55 0.6 0.76mm Leaded Tin BGA Rework Repair Tool Reballing Reapir
1.Solder (Tin) paste is the best choice of reballing IC.
2.It is used instead of the pin in the IC component package structure.
3.Please Note: There are 25000Pcs/Bottle.The size of the bottle is fixed.The bigger the Reballing Balls, the more loaded it is.If it is a small Reballing balls,the product will only occupy a small space for the bottle.
Brand new and high quality.
Tin ball: 0.76, 0.65,0.6, 0.55, 0.5, 0.45, 0.40, 0.35, 0.3, 0.25MM
Balls Alloy: Sn63/Pb37
Standard: RoHs Available & SGS Tested
2.Please allow 1-2mm error due to manual measurement and make sure you do not mind before ordering.
3.Please understand that colors may exist chromatic aberration as the different placement of pictures.
|Model||25K/Bottle BGA Solder Ball|
|Model Number||BGA Solder Ball 0.2-0.76MM|